The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Dec. 19, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Feras Eid, Chandler, AZ (US);

Jessica Gullbrand, Forest Grove, OR (US);

Melissa A. Cowan, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/467 (2006.01); H05K 7/20 (2006.01); B81C 1/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/467 (2013.01); B81C 1/00238 (2013.01); H01L 21/4846 (2013.01); H01L 21/6835 (2013.01); H01L 23/49838 (2013.01); H05K 1/0203 (2013.01); H05K 2201/10378 (2013.01);
Abstract

Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.


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