The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Mar. 29, 2017
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chen-Fa Lu, Kaohsiung, TW;

Cheng-Yuan Tsai, Hsin-Chu County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 21/66 (2006.01); H01L 21/3065 (2006.01); H01J 49/00 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
H01L 22/30 (2013.01); H01J 49/0018 (2013.01); H01L 21/3065 (2013.01); H01L 22/12 (2013.01); H01L 41/0926 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A stress monitoring device includes an anchor structure, a freestanding structure and a Vernier structure. The anchor structure is over a substrate. The freestanding structure is over the substrate, wherein the freestanding structure is connected to the anchor structure and includes a free end suspended from the substrate. The Vernier structure is over the substrate and adjacent to the free end of the freestanding structure, wherein the Vernier structure comprises scales configured to measure a displacement of the free end of the freestanding structure.


Find Patent Forward Citations

Loading…