The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Jul. 26, 2016
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Aaron Archer Waterman, Mountain View, CA (US);

Yuichiro Morozumi, Yamanashi, JP;

Tetsushi Ozaki, Yamanashi, JP;

Sanjeev Kaushal, San Jose, CA (US);

Sukesh Janubhai Patel, Cupertino, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/41 (2006.01); G05B 19/418 (2006.01); H01L 21/67 (2006.01); G06N 99/00 (2010.01); G06F 17/30 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G06F 17/3053 (2013.01); G06N 99/005 (2013.01); H01L 21/67288 (2013.01); G05B 2219/31336 (2013.01); G05B 2219/32368 (2013.01); G05B 2219/37224 (2013.01);
Abstract

A system and method for autonomously tracing a cause of particle contamination during semiconductor manufacture is provided. A contamination analysis system analyzes tool process logs together with particle contamination data for multiple process runs to determine a relationship between systematic particle contamination levels and one or more tool parameters. This relationship is used to predict expected contamination levels associated with regular usage of the tool, and to identify which tool parameters have the largest impact on expected levels of particle contamination. The contamination analysis system also identifies process logs showing unexpected deviant particle contamination levels that exceed expected contamination levels, and traces the cause of the deviant particle contamination to particular process log parameter events.


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