The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Oct. 09, 2015
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kuniaki Yamaguchi, Tokyo, JP;

Itsuki Kobata, Tokyo, JP;

Toshio Mizuno, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/11 (2012.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 37/11 (2013.01); H01L 21/67051 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67219 (2013.01);
Abstract

A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.


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