The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Jan. 24, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Shing-Chao Chen, Zhubei, TW;
Chih-Wei Lin, Zhubei, TW;
Ching-Yao Lin, New Taipei, TW;
Ming-Da Cheng, Zhubei, TW;
Ching-Hua Hsieh, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A package structure and methods for forming the same are provided. The package structure includes an integrated circuit die in a package layer. The package structure also includes a first passivation layer covering the package layer and the integrated circuit die, and a second passivation layer over the first passivation layer. The package structure further includes a seed layer and a conductive layer in the second passivation layer. The seed layer covers the top surface of the first passivation layer and extends into the first passivation layer. The conductive layer covers the seed layer and extends into the first passivation layer. In addition, the package structure includes a third passivation layer covering the second passivation layer. The seed layer further extends from the top surface of the first passivation layer to the third passivation layer along a sidewall of the conductive layer.