The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Jul. 17, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tomohiro Iseki, Koshi, JP;

Hirofumi Takeguchi, Koshi, JP;

Yuichi Terashita, Koshi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/12 (2006.01); G06F 19/00 (2018.01); G03F 7/32 (2006.01); G03F 7/30 (2006.01); H01L 21/67 (2006.01); B05D 1/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/32 (2013.01); G03F 7/3021 (2013.01); B05D 1/005 (2013.01); G06F 19/00 (2013.01); H01L 21/6715 (2013.01);
Abstract

There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.


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