The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2018
Filed:
Feb. 26, 2015
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Ying-Jui Huang, Zhubei, TW;
Chung-Shi Liu, Hsinchu, TW;
Hsin-Hung Liao, Taipei, TW;
Chien-Ling Hwang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C25D 1/22 (2006.01); C25D 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); C25D 1/00 (2013.01); C25D 1/22 (2013.01); H01L 24/13 (2013.01); H01L 2224/11001 (2013.01); H01L 2224/1111 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13017 (2013.01); H01L 2924/2064 (2013.01);
Abstract
A method of manufacturing micro pins includes forming a release layer over a substrate. A pattern layer is formed over the release layer, in which the pattern layer has a plurality of openings spaced apart to each other and through the pattern layer. A plurality of micro pins are respectively formed in the openings. The pattern layer and the release layer are removed to obtain the micro pins. An isolated conductive micro pin for connecting one or more components is also provided.