The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

May. 19, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Yukihiro Wakamoto, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 11/10 (2006.01); B05C 5/02 (2006.01); H01L 21/67 (2006.01); B05B 12/02 (2006.01);
U.S. Cl.
CPC ...
B05C 11/1015 (2013.01); B05C 5/0208 (2013.01); B05C 5/0216 (2013.01); B05C 5/0254 (2013.01); H01L 21/6715 (2013.01); H01L 21/67253 (2013.01); B05B 12/02 (2013.01);
Abstract

At the time of initiating coating, when a first end of an ejecting port of a coating nozzle is located at one end of a peripheral edge of a wafer, the wafer and the coating nozzle are relatively moved by a moving mechanism while exposing a coating liquid from the ejecting port. During the coating, the wafer and the coating nozzle are relatively moved by the moving mechanism while the coating liquid ejected from the ejecting port is in contact with the wafer, to coat the coating liquid on the wafer. At the time of finishing the coating, when a second end of the ejecting port is located at the other end of the peripheral edge of the wafer, the wafer and the coating nozzle are relatively moved by the moving mechanism while exposing the coating liquid from the ejecting port.


Find Patent Forward Citations

Loading…