The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Feb. 25, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Osvaldo Jorge Lopez, Annandale, NJ (US);

Jonathan Almeria Noquil, Bethlehem, PA (US);

Thomas Eugene Grebs, Bethlehem, PA (US);

Simon John Molloy, Allentown, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/06 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 23/053 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 29/06 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/50 (2013.01); H01L 23/053 (2013.01); H01L 23/06 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 29/0657 (2013.01); H01L 23/49844 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/97 (2013.01); H01L 2225/00 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/04642 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1037 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1425 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15156 (2013.01);
Abstract

An electronic system comprises a first chip of single-crystalline semiconductor shaped as a hexahedron and including a first electronic device embedded in a second chip of single-crystalline semiconductor shaped as a container having a slab bordered by retaining walls, and including a second electronic device. The container shaped as a slab bordered by the retaining walls and including conductive traces and terminals. The first chip is attached to the slab of second chip, forming nested chips. The first and second chips embedded in the container. The nested first and second chips are operable as an electronic system and the container is operable as the package of the system.


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