The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

May. 20, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Changhan Hobie Yun, San Diego, CA (US);

David Francis Berdy, San Diego, CA (US);

Chengjie Zuo, San Diego, CA (US);

Daeik Daniel Kim, Del Mar, CA (US);

Jonghae Kim, San Diego, CA (US);

Mario Francisco Velez, San Diego, CA (US);

Niranjan Sunil Mudakatte, San Diego, CA (US);

Robert Paul Mikulka, Oceanside, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01F 5/00 (2006.01); H01F 41/04 (2006.01); H01P 1/203 (2006.01); H03H 7/09 (2006.01); H05K 1/18 (2006.01); H03H 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); H05K 3/40 (2006.01); H01P 1/213 (2006.01); H01P 5/12 (2006.01); H03H 7/46 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01F 5/003 (2013.01); H01F 41/04 (2013.01); H01F 41/041 (2013.01); H01P 1/203 (2013.01); H01P 1/2135 (2013.01); H01P 5/12 (2013.01); H03H 1/00 (2013.01); H03H 7/09 (2013.01); H03H 7/1758 (2013.01); H03H 7/1766 (2013.01); H03H 7/1775 (2013.01); H03H 7/463 (2013.01); H05K 1/0237 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/186 (2013.01); H05K 3/0026 (2013.01); H05K 3/18 (2013.01); H05K 3/4038 (2013.01); H03H 2001/0078 (2013.01);
Abstract

The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.


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