The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Jun. 19, 2017
Invensas Corporation, San Jose, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Pezhman Monadgemi, Fremont, CA (US);
Terrence Caskey, Santa Cruz, CA (US);
Fatima Lina Ayatollahi, Fremont, CA (US);
Belgacem Haba, Saratoga, CA (US);
Charles G. Woychik, San Jose, CA (US);
Michael Newman, Fort Collins, CO (US);
Invensas Corporation, San Jose, CA (US);
Abstract
An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.