The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Sep. 17, 2015
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Toshiki Furutani, Ogaki, JP;

Yuki Yoshikawa, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4673 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H05K 1/0271 (2013.01); H05K 3/3436 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01);
Abstract

A printed wiring board includes a core laminate body including insulating layers, conductor layers including first and second conductor layers, and via conductors having smaller end surfaces connected to the first conductor layer, a first build-up layer formed on the core body and including an interlayer, a conductor layer on the interlayer, and via conductors having smaller end surfaces connected to the first conductor layer, and a second build-up layer formed on the core body and including an interlayer and a conductor layer on the interlayer. The first conductor layer is embedded such that the first conductor layer has exposed surface on the surface of the core body, the second conductor layer is formed on the other surface of the core body, and the first conductor layer has wiring pattern having the smallest minimum width of wiring patterns of the conductor layers in the core body and build-up layers.


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