The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Jan. 20, 2016
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Tsachy Holovinger, Modiin, IL;

Liran Yerushalmi, Yaacob, IL;

David Tien, Santa Clara, CA (US);

DongSub Choi, Yongin, KR;

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/00 (2006.01); G03F 7/20 (2006.01); H01L 21/66 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G03F 9/7003 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01);
Abstract

Methods and corresponding metrology modules and systems, which measure metrology parameter(s) of a previous layer of a metrology target and/or an alignment mark, prior to producing a current layer of the metrology target, derive merit figure(s) from the measured metrology parameter(s) to indicate an inaccuracy, and compensate for the inaccuracy to enhance subsequent overlay measurements of the metrology target. In an example embodiment, methods and corresponding metrology modules and systems use stand-alone metrology tool(s) and track-integrated metrology tool(s) at distinct measurement patterns to address separately different aspects of variation among wafers.


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