The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

May. 18, 2017
Applicant:

Ultratech, Inc., San Jose, CA (US);

Inventors:

Andrew M. Hawryluk, Los Altos, CA (US);

Ganesh Sundaram, Concord, MA (US);

Ritwik Bhatia, Newtonville, MA (US);

Assignee:

Ultratech, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/36 (2006.01); H01L 33/00 (2010.01); H01L 21/02 (2006.01); H01L 21/268 (2006.01); B23K 26/12 (2014.01); H01L 29/20 (2006.01); B23K 26/03 (2006.01); B23K 26/073 (2006.01); B23K 26/122 (2014.01); C23C 16/56 (2006.01); H01L 21/324 (2006.01); C23C 16/22 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0262 (2013.01); B23K 26/034 (2013.01); B23K 26/0738 (2013.01); B23K 26/122 (2013.01); B23K 26/1224 (2015.10); C23C 16/22 (2013.01); C23C 16/56 (2013.01); H01L 21/0254 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02598 (2013.01); H01L 21/02675 (2013.01); H01L 21/02694 (2013.01); H01L 21/268 (2013.01); H01L 21/3245 (2013.01); H01L 29/2003 (2013.01); B23K 2203/56 (2015.10);
Abstract

Method and devices are disclosed for device manufacture of gallium nitride devices by growing a gallium nitride layer on a silicon substrate using Atomic Layer Deposition (ALD) followed by rapid thermal annealing. Gallium nitride is grown directly on silicon or on a barrier layer of aluminum nitride grown on the silicon substrate. One or both layers are thermally processed by rapid thermal annealing. Preferably the ALD process use a reaction temperature below 550° C. and preferable below 350° C. The rapid thermal annealing step raises the temperature of the coating surface to a temperature ranging from 550 to 1500° C. for less than 12 msec.


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