The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

May. 23, 2016
Applicant:

Canon Anelva Corporation, Kawasaki-shi, JP;

Inventors:

Takuya Seino, Kawasaki, JP;

Manabu Ikemoto, Sagamihara, JP;

Kimiko Mashimo, Tokyo, JP;

Assignee:

CANON ANELVA CORPORATION, Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 29/51 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02049 (2013.01); H01J 37/3244 (2013.01); H01J 37/32091 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/28194 (2013.01); H01L 21/28202 (2013.01); H01L 21/67196 (2013.01); H01L 29/517 (2013.01); H01L 21/02573 (2013.01); H01L 21/02658 (2013.01); H01L 29/495 (2013.01); H01L 29/4916 (2013.01); H01L 29/4966 (2013.01); H01L 29/4975 (2013.01); H01L 29/66651 (2013.01);
Abstract

It was found out that when radicals generated by plasma are fed to a treatment chamber via a plurality of holes () formed on a partition plate which separates a plasma-forming chamber () from the treatment chamber, and the radicals are mixed with a treatment gas which is separately fed to the treatment chamber, the excitation energy of the radicals is suppressed and thereby the substrate surface treatment at high Si-selectivity becomes possible, which makes it possible to conduct the surface treatment of removing native oxide film and organic matter without deteriorating the flatness of the substrate surface. The radicals in the plasma are fed to the treatment chamber via radical-passing holes () of a plasma-confinement electrode plate () for plasma separation, the treatment gas is fed to the treatment chamber () to be mixed with the radicals in the treatment chamber, and then the substrate surface is cleaned by the mixed atmosphere of the radicals and the treatment gas.


Find Patent Forward Citations

Loading…