The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 18, 2018

Filed:

Feb. 18, 2014
Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Keisuke Shinohara, Saitama, JP;

Masafumi Ogata, Saitama, JP;

Hiroshi Miyazawa, Saitama, JP;

Akira Sugawara, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C25D 5/10 (2006.01); C25D 3/46 (2006.01); C25D 7/00 (2006.01); H01H 1/025 (2006.01); H01H 11/04 (2006.01); H01R 13/03 (2006.01); C25D 5/34 (2006.01);
U.S. Cl.
CPC ...
C25D 5/10 (2013.01); C25D 3/46 (2013.01); C25D 7/00 (2013.01); H01H 1/025 (2013.01); H01H 11/041 (2013.01); C25D 5/34 (2013.01); H01H 2011/046 (2013.01); H01R 13/03 (2013.01);
Abstract

There is provided a silver-plated product which has good thermal resistance, bendability and wear resistance. In a silver-plated product wherein a surface layer of silver having a thickness of 10 μm or less is formed on a base material of copper or a copper alloy, the full-width at half maximum of a rocking curve on a preferred orientation plane (preferably {200} or {111} plane) of the surface layer is caused to be 2 to 8°, preferably 3 to 7°, to improve the out-of-plane orientation of the surface layer to improve the thermal resistance, bendability and wear resistance of the silver-plated product.


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