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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10074625 B1

PDFFull Text
Date of Patent:
Sep. 11, 2018

Filed:

Sep. 20, 2015

Wafer level package (wlp) ball support using cavity structure

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Mario Francisco Velez, San Diego, CA (US);

David Francis Berdy, San Diego, CA (US);

Changhan Hobie Yun, San Diego, CA (US);

Jonghae Kim, San Diego, CA (US);

Chengjie Zuo, Santee, CA (US);

Daeik Daniel Kim, Del Mar, CA (US);

Je-Hsiung Jeffrey Lan, San Diego, CA (US);

Niranjan Sunil Mudakatte, San Diego, CA (US);

Robert Paul Mikulka, Oceanside, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

David Zarneke

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 24/03 (2013.01); H01L 24/09 (2013.01); H01L 24/11 (2013.01); H01L 2224/023 (2013.01); H01L 2224/0905 (2013.01);
Abstract

An integrated circuit device in a wafer level package (WLP) includes ball grid array (BGA) balls fabricated with cavities filled with adhesives for improved solder joint reliability.

Find Patent Forward Citations

Quick Actions:

Velez, Mario. (2018). Wafer level package (wlp) ball support using cavity structure (U.S. Patent No. 10074625). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10074625

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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