The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Sep. 09, 2013
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Keiki Ito, Miyagi, JP;

Masaki Nishikawa, Miyagi, JP;

Naohiko Okunishi, Miyagi, JP;

Junichi Shimada, Saitama, JP;

Ken Koyanagi, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H03H 1/00 (2006.01); H01F 17/06 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32165 (2013.01); H01F 17/062 (2013.01); H01J 37/3211 (2013.01); H01J 37/32091 (2013.01); H01J 37/32174 (2013.01); H03H 1/0007 (2013.01); H01J 37/32155 (2013.01); H01J 2237/334 (2013.01);
Abstract

Provided is a plasma processing apparatus in which an external circuit is electrically connected, via a line, to a predetermined electric member within a processing container thereof, and noises of first and second high frequency waves are attenuated or blocked by a filter provided on the line when the noises enter the line from the electric member toward the external circuit. The filter includes: an air core coil provided at a first stage when viewed from the electric member side; a toroidal coil connected in series with the air core coil; an electroconductive casing configured to accommodate or enclose the air core coil and the toroidal coil; a first condenser electrically connected between a connection point between the air core coil and the toroidal coil and the casing; and a second condenser connected between a terminal of the toroidal coil at the external circuit side and the casing.


Find Patent Forward Citations

Loading…