The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Aug. 16, 2013
Applicant:

Fogale Nanotech, Nimes, FR;

Inventors:

Gilles Fresquet, Garrigues Sainte Eulalie, FR;

Sylvain Perrot, Palaiseau, FR;

Assignee:

UNITY SEMICONDUCTOR, Montbonnot-Saint-Martin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/00 (2011.01); G06T 7/00 (2017.01); B24B 49/12 (2006.01); G01B 11/06 (2006.01); G01N 21/95 (2006.01); B24B 37/005 (2012.01); G01B 9/02 (2006.01); G01B 11/14 (2006.01); H04N 5/225 (2006.01); H04N 7/18 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0012 (2013.01); B24B 37/005 (2013.01); B24B 49/12 (2013.01); G01B 9/02091 (2013.01); G01B 11/06 (2013.01); G01B 11/0633 (2013.01); G01B 11/0683 (2013.01); G01B 11/14 (2013.01); G01N 21/9501 (2013.01); G06T 7/001 (2013.01); G06T 7/0008 (2013.01); H04N 5/2256 (2013.01); H04N 7/18 (2013.01); G06T 2207/10004 (2013.01); G06T 2207/10152 (2013.01); G06T 2207/30148 (2013.01);
Abstract

An imaging device is provided for localizing structures through the surface of an object such as a wafer, with a view to positioning a measuring sensor relative to the structures, includes: (i) an imaging sensor; (ii) an optical imager able to produce, on the imaging sensor, an image of the object in a field of view; and (iii) an illuminator for generating an illuminating beam and lighting the field of view in reflection, in which the illuminating beam and lighting the field of view in reflection, in which the illuminator is able to generate an illuminating beam the spectral content of which is adapted to the nature of the object, such that the light of the beam is able to essentially penetrate into the object. Also provided is a system and a method for carrying out dimensional measurements on an object such as a wafer.


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