The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Feb. 18, 2014
Dowa Metaltech Co., Ltd., Tokyo, JP;
Keisuke Shinohara, Saitama, JP;
Masafumi Ogata, Saitama, JP;
Hiroshi Miyazawa, Saitama, JP;
Akira Sugawara, Shizuoka, JP;
DOWA METALTECH CO., LTD., Tokyo, JP;
Abstract
There is provided a silver-plated product wherein a surface layer of silver is formed on the surface of an underlying layer of nickel formed on a base material, the silver-plated product having a good bendability. In a silver-plated product which comprises a base material of copper or a copper alloy, an underlying layer of nickel formed on the base material, and a surface layer of silver formed on the surface of the underlying layer, the surface layer having a thickness of 10 μm or less, the thickness of the underlying layer is 2 μm or less, preferably 1.5 μm or less, and the area fraction in {200} orientation of the surface layer is 15% or more, preferably 25% or more.