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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10069474 B1

PDFFull Text
Date of Patent:
Sep. 04, 2018

Filed:

Apr. 25, 2016

Encapsulation of acoustic resonator devices

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Changhan Hobie Yun, San Diego, CA (US);

Chengjie Zuo, San Diego, CA (US);

Daeik Daniel Kim, Del Mar, CA (US);

Mario Francisco Velez, San Diego, CA (US);

Niranjan Sunil Mudakatte, San Diego, CA (US);

Je-Hsiung Jeffrey Lan, San Diego, CA (US);

David Francis Berdy, San Diego, CA (US);

Yunfei Ma, Santa Clara, CA (US);

Robert Paul Mikulka, Oceanside, CA (US);

Jonghae Kim, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Qualcomm Incorporated-Toler

Primary Examiner:

Barbara Summons

Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/15 (2006.01); H03H 3/02 (2006.01); H01F 17/02 (2006.01); H05K 1/18 (2006.01); H03H 9/54 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H03H 3/08 (2006.01); H03H 9/64 (2006.01); H01F 17/00 (2006.01); H03H 7/01 (2006.01); H03H 7/46 (2006.01);
U.S. Cl.
CPC ...
H03H 9/542 (2013.01); H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/0547 (2013.01); H03H 9/0557 (2013.01); H03H 9/0561 (2013.01); H03H 9/1014 (2013.01); H03H 9/1071 (2013.01); H03H 9/64 (2013.01); H05K 1/0306 (2013.01); H05K 1/185 (2013.01); H05K 3/0014 (2013.01); H05K 3/4602 (2013.01); H01F 17/0013 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0026 (2013.01); H03H 7/0123 (2013.01); H03H 7/461 (2013.01);
Abstract

A device includes an acoustic resonator embedded within an encapsulating structure that at least partially encapsulates the acoustic resonator. The device includes an inductor electrically connected to the acoustic resonator. At least a portion of the inductor is embedded in the encapsulating structure.

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