The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

May. 20, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yusuke Hirayama, Miyagi, JP;

Masaaki Miyagawa, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/311 (2006.01); C23C 16/44 (2006.01); H01L 21/205 (2006.01); H01L 21/3065 (2006.01); H05H 1/46 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); C23C 16/4404 (2013.01); C23C 16/4405 (2013.01); H01J 37/32009 (2013.01); H01J 37/3244 (2013.01); H01J 37/3266 (2013.01); H01J 37/32165 (2013.01); H01J 37/32449 (2013.01); H01J 37/32477 (2013.01); H01L 21/02115 (2013.01); H01L 21/02123 (2013.01); H01L 21/02164 (2013.01); H01L 21/02208 (2013.01); H01L 21/02274 (2013.01); H01L 21/205 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H05H 1/46 (2013.01); H01J 2237/334 (2013.01);
Abstract

This plasma processing method includes a film formation step, a plasma processing step and a removal step. In the film formation step, a silicon oxide film is formed on the surface of a member within a chamber by means of plasma of an oxygen-containing gas and a silicon-containing gas at a flow rate ratio of the oxygen-containing gas to the silicon-containing gas of 0.2-1.4. In the plasma processing step, after the formation of the silicon oxide film on the surface of the member, an object to be processed that has been carried into the chamber is subjected to plasma processing with use of plasma of a processing gas. In the removal step, after carrying the plasma-processed object out of the chamber, the silicon oxide film is removed from the surface of the member by means of plasma of a fluorine-containing gas.


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