The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Sep. 10, 2015
Applicant:

Csmc Technologies Fab1 Co., Ltd., Wuxi New District, Jiangsu, CN;

Inventors:

Shengrong Zhong, Jiangsu, CN;

Xiaoshe Deng, Jiangsu, CN;

Dongfei Zhou, Jiangsu, CN;

Assignee:

CSMC TECHNOLOGIES FAB1 CO., LTD., Wuxi New District, Jiangsu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/78 (2006.01); H01L 21/02 (2006.01); H01L 21/04 (2006.01); H01L 29/861 (2006.01); H02M 3/158 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 29/06 (2013.01); H01L 21/02293 (2013.01); H01L 21/041 (2013.01); H01L 21/76877 (2013.01); H01L 21/78 (2013.01); H01L 29/861 (2013.01); H02M 3/1588 (2013.01); H01L 21/02378 (2013.01);
Abstract

A semiconductor rectifying device includes a substrate of a first conductivity type, an epitaxial layer of the first conductivity type, a filling structure, an upper electrode, a guard ring, and a guard layer. The epitaxial layer defines a plurality of trenches thereon. The filling structure includes an insulating material formed on the inner surface of the trench and a conductive material filled in the trench. A doped region of a second conductivity type is formed in the surface of the epitaxial layer between the filling structures. A method of manufacturing a semiconductor rectifying device includes forming an epitaxial layer of a first conductivity type on a substrate of the first conductivity type, defining a plurality of trenches on the epitaxial layer, forming a plurality of filling structures in the plurality of trenches, and forming a doped region in the epitaxial layer between the filling structures.


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