The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Aug. 15, 2013
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Hiroyuki Teshima, Kitakyushu, JP;
Hisayuki Imamura, Kitakyushu, JP;
Junichi Watanabe, Kitakyushu, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H05K 3/02 (2006.01); C23F 1/02 (2006.01); C23F 1/44 (2006.01); C23F 1/30 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); C04B 37/02 (2006.01); H05K 3/06 (2006.01); H05K 3/26 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); C04B 37/026 (2013.01); C23F 1/02 (2013.01); C23F 1/30 (2013.01); C23F 1/44 (2013.01); C04B 2237/125 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/407 (2013.01); C04B 2237/68 (2013.01); C04B 2237/70 (2013.01); H05K 1/0306 (2013.01); H05K 3/06 (2013.01); H05K 3/26 (2013.01); H05K 2203/04 (2013.01); H05K 2203/0766 (2013.01); Y10T 428/12056 (2015.01);
Abstract
A method for producing a ceramic circuit substrate comprising the steps of forming brazing regions each comprising brazing material powder and an organic binder on a ceramic substrate; setting metal plates on the ceramic substrate via the brazing regions, and heating the ceramic substrate, the brazing regions and the metal plates to bond the metal plates to the ceramic substrate via brazing layers made of the brazing material, thereby forming a bonded body; and cleaning the bonded body with a hypochlorite-containing agent.