The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2018
Filed:
Mar. 14, 2016
Sj Semiconductor (Jiangyin) Corporation, JiangYin, CN;
Chengchung Lin, JiangYin, CN;
Qifeng Cai, JiangYin, CN;
SJ Semiconductor (Jiangyin) Corporation, JiangYin, CN;
Abstract
The method of fabricating a fan-out package structure comprises: S, providing a substrate (), forming an adhesive layer () on the substrate's upper surface; S, forming a redistribution layer () on the adhesive layer's upper surface; S, bonding one first chip () to the redistribution layer's upper surface, and constructing at least two first bump structures (), wherein the first chip and the first bump structures are all electrically connected to the redistribution layer, and top portions of the first bump structures are taller than a top portion of the first chip; S, forming a plastic encapsulation layer () on the upper surface of the redistribution layer, wherein the plastic encapsulation layer embeds the first chip and exposes upper ends of the first bump structures; and S, removing the substrate and the adhesive layer, and constructing a second bump structure () on a lower surface of the redistribution layer.