The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Sep. 08, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Veeraraghavan S. Basker, Schenectady, NY (US);

Keith H. Tabakman, Gansevoort, NY (US);

Patrick D. Carpenter, Saratoga Springs, NY (US);

Guillaume Bouche, Albany, NY (US);

Michael V. Aquilino, Saratoga Springs, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/535 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/417 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/535 (2013.01); H01L 21/76841 (2013.01); H01L 21/76895 (2013.01); H01L 29/41791 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

One aspect of the disclosure relates to an integrated circuit structure. The integrated circuit structure may include: a contact line being disposed within a dielectric layer and providing electrical connection to source/drain epitaxial regions surrounding a set of fins, the contact line including: a first portion of the contact line electrically isolated from a second portion of the contact line by a contact line spacer, wherein the first portion and the second portion each include a liner layer and a metal, the liner layer separating the metal from the dielectric layer and the source/drain epitaxial regions, and wherein the metal is directly in contact with the contact line spacer.


Find Patent Forward Citations

Loading…