The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Mar. 28, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Edward Fuergut, Dasing, DE;
Holger Doepke, Sinzing, DE;
Olaf Hohlfeld, Warstein, DE;
Michael Juerss, Regenstauf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H05K 3/28 (2006.01); H01L 25/07 (2006.01); H01L 21/52 (2006.01); H01L 23/29 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/295 (2013.01); H01L 24/05 (2013.01); H01L 21/563 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/552 (2013.01); H01L 23/562 (2013.01); H01L 24/06 (2013.01); H05K 3/282 (2013.01); H05K 2201/09872 (2013.01); H05K 2203/1377 (2013.01);
Abstract
A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.