The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

May. 10, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Xinyuan Dou, Clifton Park, NY (US);

Hong Yu, Rexford, NY (US);

Zhenyu Hu, Clifton Park, NY (US);

Xing Zhang, Clifton Park, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 29/10 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823456 (2013.01); H01L 21/823412 (2013.01); H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 29/1033 (2013.01); H01L 29/42376 (2013.01);
Abstract

Methods of reducing the SC GH on a FinFET device while protecting the LC devices and the resulting devices are provided. Embodiments include forming an ILD over a substrate of a FinFET device, the ILD having a SC region and a LC region; forming a SC gate and a LC gate within the SC and LC regions, respectively, an upper surface of the SC and LC gates being substantially coplanar with an upper surface of the ILD; forming a lithography stack over the LC region; recessing the SC gate; stripping the lithography stack; forming a SiN cap layer over the SC and LC regions; forming a TEOS layer over the SiN cap layer; and planarizing the TEOS layer.


Find Patent Forward Citations

Loading…