The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Feb. 15, 2013
Applicants:

Alain Salles, Ramonville St Agne, FR;

Kamel Abouda, Saint Lys, FR;

Patrice Besse, Tournefeuille, FR;

Inventors:

Alain Salles, Ramonville St Agne, FR;

Kamel Abouda, Saint Lys, FR;

Patrice Besse, Tournefeuille, FR;

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/20 (2006.01); G01R 15/18 (2006.01); H01L 25/065 (2006.01); G01R 31/28 (2006.01); G01R 3/00 (2006.01); G01R 19/00 (2006.01); H01L 49/02 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G01R 15/18 (2013.01); G01R 3/00 (2013.01); G01R 15/181 (2013.01); G01R 19/0092 (2013.01); G01R 31/2884 (2013.01); H01L 25/065 (2013.01); H01L 27/0248 (2013.01); H01L 28/10 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49009 (2015.01);
Abstract

An integrated circuit die includes a stack of a substrate and multiple layers extending in parallel to the substrate. A number of integrated electronic components is formed in the stack, and connected to form an electronic circuit. The electronic circuit comprises a first electric contact, a second electric contact, and a coupling which couples the electric strips electrically to each other. The coupling includes a circuit via which extends through at least two of the layers. The die further includes an integrated current sensor having a coil arrangement for sensing a current flowing through a part of the electronic circuit. The coil arrangement is magnetically coupled to the circuit via over at least a part of a length of the circuit via to sensing a magnetic flux through the circuit via. A measurement unit can measure a parameter of the coil arrangement representative of a current flowing through the circuit via.


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