The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2018

Filed:

May. 10, 2017
Applicants:

United Microelectronics Corp., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian province, CN;

Inventors:

Li-Chiang Chen, Tainan, TW;

Fu-Che Lee, Taichung, TW;

Ming-Feng Kuo, Tainan, TW;

Hsien-Shih Chu, Kaohsiung, TW;

Cheng-Yu Wang, Kaohsiung, TW;

Yu-Chen Chuang, Kaohsiung, TW;

Assignees:

UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;

Fujian Jinhua Integrated Circuit Co., Ltd., Quanzhou, Fujian province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); B23P 15/00 (2006.01); C03C 25/00 (2018.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0335 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01);
Abstract

A method of fabricating a mask pattern includes providing numerous masks on a substrate. A wider trench and a narrower trench are respectively defined between the mask. Subsequently, a mask material is formed to fill in the wider trench and the narrower trench. The top surface of the mask material overlapping the wider trench is lower than the top surface of the mask material overlapping the narrower trench. A photoresist layer is formed on the mask material overlapping the wider trench. Later, the mask material overlapping the narrower trench is etched while the mask material overlapping the wider trench is protected by the photoresist layer.


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