The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Jul. 02, 2015
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H05K 3/34 (2006.01); H05K 3/42 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H05K 1/111 (2013.01); H05K 1/112 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H05K 1/118 (2013.01); H05K 3/0038 (2013.01); H05K 3/3436 (2013.01); H05K 3/3452 (2013.01); H05K 3/429 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2203/025 (2013.01); H05K 2203/1572 (2013.01);
Abstract
A wiring substrate includes a core layer, a first wiring layer, a first insulating layer, a first via wiring, a second wiring layer, a second insulating layer, a second via wiring, a third wiring layer, a third insulating layer, a third via wiring, and a through-wiring. The through-wiring includes upper and lower end surfaces. The upper end surface has an area that is smaller than an area of the lower end surface. The upper surface of the first insulating layer is more flat than the lower surface of the third insulating layer. The second wiring layer has a wiring density that is higher than a wiring density of the first wiring layer.