The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jan. 18, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Daniel Chanemougame, Niskayuna, NY (US);

Andre Labonte, Mechanicville, NY (US);

Ruilong Xie, Schenectady, NY (US);

Lars Liebmann, Mechanicsville, NY (US);

Nigel Cave, Saratoga Springs, NY (US);

Guillaume Bouche, Albany, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 23/535 (2006.01); H01L 29/66 (2006.01); H01L 21/768 (2006.01); H01L 29/06 (2006.01); H01L 21/306 (2006.01); H01L 21/84 (2006.01); H01L 21/28 (2006.01); H01L 27/12 (2006.01); H01L 27/092 (2006.01); H01L 27/088 (2006.01); H01L 29/78 (2006.01); H01L 29/417 (2006.01); H01L 21/02 (2006.01); H01L 29/40 (2006.01); H01L 21/764 (2006.01); H01L 21/8238 (2006.01); H01L 27/108 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4991 (2013.01); H01L 21/0217 (2013.01); H01L 21/28141 (2013.01); H01L 21/30604 (2013.01); H01L 21/764 (2013.01); H01L 21/7682 (2013.01); H01L 21/76805 (2013.01); H01L 21/76895 (2013.01); H01L 21/845 (2013.01); H01L 23/535 (2013.01); H01L 27/0886 (2013.01); H01L 27/0924 (2013.01); H01L 27/1211 (2013.01); H01L 29/0649 (2013.01); H01L 29/401 (2013.01); H01L 29/41791 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01); H01L 29/6681 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 21/823431 (2013.01); H01L 21/823468 (2013.01); H01L 21/823821 (2013.01); H01L 27/10826 (2013.01); H01L 27/10844 (2013.01); H01L 29/66636 (2013.01); H01L 29/66689 (2013.01); H01L 29/66719 (2013.01); H01L 2924/13067 (2013.01);
Abstract

Disclosed are integrated circuit (IC) structures and formation methods. In the methods, a gate with a sacrificial gate cap and a sacrificial gate sidewall spacer is formed on a channel region. The cap and sidewall spacer are removed, creating a cavity with a lower portion between the sidewalls of the gate and adjacent metal plugs and with an upper portion above the lower portion and the gate. A first dielectric layer is deposited, forming an air-gap in the lower portion and lining the upper portion. A second dielectric layer is deposited, filling the upper portion. During formation of a gate contact opening (optionally over an active region), the second dielectric layer is removed and the first dielectric layer is anisotropically etched, thereby exposing the gate and creating a dielectric spacer with a lower air-gap segment and an upper solid segment. Metal deposited into the opening forms the gate contact.


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