The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Jan. 31, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Mayue Xie, Phoenix, AZ (US);
Zhiyong Wang, Chandler, AZ (US);
Yuan-Chuan Steven Chen, Portland, OR (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); H01L 21/66 (2006.01); H01L 27/02 (2006.01); H01L 23/50 (2006.01); H01L 29/861 (2006.01); H01L 49/02 (2006.01); G01R 31/26 (2014.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G01R 31/2642 (2013.01); H01L 22/32 (2013.01); H01L 23/50 (2013.01); H01L 27/0296 (2013.01); H01L 28/20 (2013.01); H01L 29/861 (2013.01);
Abstract
Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.