The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Aug. 03, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Swaminathan T. Srinivasan, Pleasanton, CA (US);

Fareen Adeni Khaja, San Jose, CA (US);

Errol Antonio C. Sanchez, Tracy, CA (US);

Patrick M. Martin, Ipswich, MA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 29/267 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02658 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/0254 (2013.01); H01L 21/0259 (2013.01); H01L 21/02164 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02488 (2013.01); H01L 21/02513 (2013.01); H01L 21/02538 (2013.01); H01L 21/02543 (2013.01); H01L 21/02546 (2013.01); H01L 21/311 (2013.01); H01L 21/31116 (2013.01); H01L 29/045 (2013.01); H01L 29/0649 (2013.01); H01L 29/0684 (2013.01); H01L 29/267 (2013.01);
Abstract

Embodiments of the present disclosure relate to reducing dislocation density in a heteroepitaxial growth film and devices including heteroepitaxial films with reduced dislocation density. According to embodiments of the present disclosure, sidewalls of high aspect ratio trenches may be tilted or angled to allow defects in crystalline material formed in the high aspect ratio trenches to be terminated in the tilted sidewalls, including defects propagating along the length of the high aspect ratio trenches. Embodiments of the present disclosure may be used to reduce defects in heteroepitaxial growth on silicon (Si) for microelectronic applications, such as high mobility channels using Group III-V elements in field effect transistors.


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