The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jul. 22, 2015
Applicants:

Sixpoint Materials, Inc., Buellton, CA (US);

Seoul Semiconductor Co., Ltd., Seoul, KR;

Inventor:

Tadao Hashimoto, Santa Barbara, CA (US);

Assignees:

SixPoint Materials, Inc., Buellton, CA (US);

Seoul Semiconductor Co., Ltd., Ansan-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 23/207 (2018.01); C01B 21/06 (2006.01); H01L 21/306 (2006.01); H01L 21/02 (2006.01); H01L 29/04 (2006.01); C30B 29/40 (2006.01); C30B 33/00 (2006.01); B24B 37/04 (2012.01); H01L 21/66 (2006.01); H01L 29/20 (2006.01); H01L 21/78 (2006.01); C30B 33/06 (2006.01); C30B 7/10 (2006.01);
U.S. Cl.
CPC ...
G01N 23/207 (2013.01); B24B 37/044 (2013.01); C01B 21/0632 (2013.01); C30B 29/403 (2013.01); C30B 29/406 (2013.01); C30B 33/00 (2013.01); C30B 33/06 (2013.01); H01L 21/0201 (2013.01); H01L 21/30625 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 29/045 (2013.01); H01L 29/2003 (2013.01); C01P 2002/74 (2013.01); C30B 7/105 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The invention provides, in one instance, a group III nitride wafer sliced from a group III nitride ingot, polished to remove the surface damage layer and tested with x-ray diffraction. The x-ray incident beam is irradiated at an angle less than 15 degree and diffraction peak intensity is evaluated. The group III nitride wafer passing this test has sufficient surface quality for device fabrication. The invention also provides, in one instance, a method of producing group III nitride wafer by slicing a group III nitride ingot, polishing at least one surface of the wafer, and testing the surface quality with x-ray diffraction having an incident beam angle less than 15 degree to the surface. The invention also provides, in an instance, a test method for testing the surface quality of group III nitride wafers using x-ray diffraction having an incident beam angle less than 15 degree to the surface.


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