The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Apr. 05, 2016
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Mark D. Smith, Austin, TX (US);

Jose Solomon, Belmont, CA (US);

Stuart Sherwin, San Jose, CA (US);

Walter Mieher, Los Gatos, CA (US);

Ady Levy, San Jose, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 9/02 (2006.01); G01B 11/02 (2006.01); G01L 1/24 (2006.01); G01B 11/16 (2006.01); G01B 11/24 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01B 11/161 (2013.01); G01B 9/02021 (2013.01); G01B 9/02027 (2013.01); G01B 11/2441 (2013.01); G01B 2210/56 (2013.01); H01L 22/12 (2013.01);
Abstract

The determination of in-plane distortions of a substrate includes measuring one or more out-of-plane distortions of the substrate in an unchucked state, determining an effective film stress of a film on the substrate in the unchucked state based on the measured out-of-plane distortions of the substrate in the unchucked state, determining in-plane distortions of the substrate in a chucked state based on the effective film stress of the film on the substrate in the unchucked state and adjusting at least one of a process tool or an overlay tool based on at least one of the measured out-of-plane distortions or the determined in-plane distortions.


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