The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Mar. 20, 2017
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Chih-Wei Lu, Hsinchu, TW;
Chung-Ju Lee, Hsinchu, TW;
Hsiang-Huan Lee, Jhudong Township, TW;
Tien-I Bao, Taoyuan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
The present disclosure relates to a method for forming an interconnect structure. In some embodiments, the method may be performed by forming an opening within a sacrificial layer. The sacrificial layer is over a substrate. A conductive material is formed within the opening and over the sacrificial layer. The conductive material within the opening defines a conductive body. The conductive material is patterned to define a conductive projection extending outward from the conductive body. The sacrificial layer is removed and a dielectric material is formed surrounding the conductive body and the conductive projection.