The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

Apr. 17, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ranga Rao Arnepalli, Krishna, IN;

Darshan Thakare, Maharashtra, IN;

Abhijit Basu Mallick, Fremont, CA (US);

Pramit Manna, Milpitas, CA (US);

Robert Jan Visser, Menlo Park, CA (US);

Prerna Sonthalia Goradia, Mumbai, IN;

Nilesh Chimanrao Bagul, Bangalore, IN;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/448 (2006.01); C23C 16/40 (2006.01); C23C 16/34 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4486 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/403 (2013.01); C23C 16/405 (2013.01); H01L 21/0217 (2013.01); H01L 21/02153 (2013.01); H01L 21/02164 (2013.01); H01L 21/02178 (2013.01); H01L 21/02181 (2013.01); H01L 21/02183 (2013.01); H01L 21/02186 (2013.01); H01L 21/02189 (2013.01); H01L 21/02271 (2013.01);
Abstract

Systems and methods for forming films on the surface of a substrate are described. The systems possess aerosol generators which form droplets from a liquid solution made from a solvent and a deposition precursor. A carrier gas may be flowed through the liquid solution and push the droplets toward a substrate placed in a substrate processing region. The droplets pass into the substrate processing region and chemically react with the substrate to form films. The temperature of the substrate may be maintained below the boiling temperature of the solvent during film formation. The solvent imparts a flowability to the forming film and enable the depositing film to flow along the surface of a patterned substrate during formation prior to solidifying. The flowable film results in bottom-up gapfill inside narrow high-aspect ratio gaps in the patterned substrate.

Published as:

Find Patent Forward Citations

Loading…