The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2018

Filed:

May. 08, 2014
Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Takafumi Endo, Toyama, JP;

Keisuke Hashimoto, Toyama, JP;

Hirokazu Nishimaki, Toyama, JP;

Rikimaru Sakamoto, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07C 39/15 (2006.01); G03F 7/11 (2006.01); G03F 7/32 (2006.01); C07C 37/68 (2006.01); G03F 7/16 (2006.01); C09D 179/02 (2006.01); C09D 179/04 (2006.01); C09D 161/12 (2006.01); G03F 7/09 (2006.01); H01L 21/311 (2006.01); C08G 73/06 (2006.01);
U.S. Cl.
CPC ...
C09D 179/02 (2013.01); C08G 73/06 (2013.01); C09D 161/12 (2013.01); C09D 179/04 (2013.01); G03F 7/091 (2013.01); G03F 7/094 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01);
Abstract

Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Arand Areach are Caryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.


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