The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Jan. 04, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Pei-Chun Tsai, Zhongli, TW;
Yu-Jen Tseng, Hsin-Chu, TW;
Tin-Hao Kuo, Hsin-Chu, TW;
Chen-Shien Chen, Zhubei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/02 (2013.01); H01L 21/76885 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 24/14 (2013.01); H01L 2224/0215 (2013.01); H01L 2224/02125 (2013.01); H01L 2224/02141 (2013.01); H01L 2224/02145 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/10125 (2013.01); H01L 2224/1112 (2013.01); H01L 2224/11013 (2013.01); H01L 2224/11019 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11472 (2013.01); H01L 2224/136 (2013.01); H01L 2224/13015 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13551 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/13565 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13686 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/8181 (2013.01); H01L 2224/8192 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/181 (2013.01); H01L 2924/301 (2013.01); H01L 2924/35 (2013.01); Y10T 29/49144 (2015.01);
Abstract
An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the copper pillar having a tapering curved profile, which has a larger bottom critical dimension (CD) than a top critical dimension (CD) in an embodiment, a metal cap mounted on the copper pillar, and a solder feature mounted on the metal cap.