The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Jul. 20, 2015
Applicants:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

National Taiwan University, Taipei, TW;

Inventors:

Kuen-Yu Tsai, Taipei, TW;

Meng-Fu You, Changhua, TW;

Yi-Chang Lu, Linkou Township, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/10 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5081 (2013.01);
Abstract

The present disclosure relates to a curve-fitting procedure for determining proximity effect device parameters in semiconductor fabrication. Methods presented herein are adapted to determine the impact of narrow width related effects on device characteristics by comparing two-dimensional (2D) and/or three-dimensional (3D) device simulations. Methods presented herein are adapted to determine the accuracy of conventional extraction methods utilizing non-rectangular gate device simulation.


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