The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Oct. 10, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Prayudi Lianto, Singapore, SG;

Kuma Hsiung, Taipei, TW;

Eric J. Bergman, Kalispell, MT (US);

John L. Klocke, Kalispell, MT (US);

Mohamed Rafi, Singapore, SG;

Muhammad Azim, Singapore, SG;

Guan Huei See, Singapore, SG;

Arvind Sundarrajan, Singapore, SG;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3105 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31053 (2013.01); H01L 21/31058 (2013.01); H01L 21/68764 (2013.01);
Abstract

A polymer layer on a substrate may be treated with ozone gas or with deionized water and ozone gas to increase a removal rate of the polymer layer in a chemical mechanical polishing (CMP) process. The ozone gas may be diffused directly into the polymer layer or through a thin layer of deionized water on the surface of the polymer layer and into the polymer layer. The deionized water may also be heated during the process to further enhance the diffusion of the ozone gas into the polymer layer.


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