The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Jun. 24, 2015
Applicant:

Sumitomo Metal Mining Co., Ltd., Tokyo, JP;

Inventors:

Tokuyuki Nakayama, Ome, JP;

Eiichiro Nishimura, Ome, JP;

Fumihiko Matsumura, Ome, JP;

Masashi Iwara, Ome, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 14/34 (2006.01); C04B 35/01 (2006.01); C04B 35/64 (2006.01); C04B 35/622 (2006.01); H01L 29/786 (2006.01); H01L 29/22 (2006.01); H01L 29/24 (2006.01); H01L 21/465 (2006.01); H01J 37/34 (2006.01); C23C 14/08 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); C04B 35/01 (2013.01); C04B 35/62218 (2013.01); C04B 35/64 (2013.01); C23C 14/086 (2013.01); H01J 37/3426 (2013.01); H01L 21/02483 (2013.01); H01L 21/02554 (2013.01); H01L 21/02565 (2013.01); H01L 21/02592 (2013.01); H01L 21/02631 (2013.01); H01L 21/465 (2013.01); H01L 29/2206 (2013.01); H01L 29/247 (2013.01); H01L 29/78693 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3275 (2013.01); C04B 2235/3279 (2013.01); C04B 2235/3286 (2013.01); C04B 2235/3296 (2013.01); C04B 2235/96 (2013.01); H01L 29/245 (2013.01);
Abstract

Provided is an oxide sintered body that, when used to obtain an oxide semiconductor thin film by sputtering, can achieve a low carrier concentration and a high carrier mobility. Also provided is a sputtering target using the oxide sintered body. The oxide sintered body contains, as oxides, indium, gallium, and at least one positive divalent element selected from the group consisting of nickel, cobalt, calcium, strontium, and lead. The gallium content, in terms of the atomic ratio Ga/(In+Ga), is from 0.20 to 0.45, and the positive divalent element content, in terms of the atomic ratio M/(In+Ga+M), is from 0.0001 to 0.05. The amorphous oxide semiconductor thin film, which is formed using the oxide sintered body as a sputtering target, can achieve a carrier concentration of less than 3.0×10cmand a carrier mobility of at least 10 cmVsec.


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