Zhengfen Wan

Title: Zhengfen Wan: Innovator in Packaging Technology

Introduction

Zhengfen Wan, a prominent inventor based in Shanghai, China, has made notable contributions to the field of packaging technology. With a keen focus on enhancing product durability and functionality, he holds one patent that showcases his innovative approach.

Latest Patents

Zhengfen Wan's most significant patent is titled "Package structure with an elastomer with lower elastic modulus." This invention presents a unique package structure that consists of a substrate, at least one electronic component, a housing, and at least one strut. The electronic component is strategically placed on the first surface of the substrate, while the housing encases it, creating an accommodation space. Notably, the strut protrudes from the housing's inner surface, reaching towards the accommodation space. An elastomer is strategically positioned between the strut and the substrate, enhancing the overall structure's resilience.

Career Highlights

Zhengfen Wan is currently employed at Delta Electronics (Shanghai) Co., Ltd., a leading company in the electronics sector. His role allows him to apply his innovative ideas in a collaborative environment, contributing to various projects aimed at advancing technological solutions.

Collaborations

Throughout his career, Zhengfen has worked alongside talented professionals, including coworkers Tao Wang and Zhenqing Zhao. Their collective efforts have fostered a creative atmosphere that encourages the development of groundbreaking technologies.

Conclusion

Zhengfen Wan's work exemplifies the spirit of innovation within the packaging technology industry. His patent reflects a commitment to enhancing product design and functionality, and his collaborations highlight the importance of teamwork in driving advancements in technology. As he continues to push the boundaries of packaging solutions, the impact of his contributions will undoubtedly resonate in the industry for years to come.