Zheng Peng Xiong

Title: Zheng Peng Xiong: Innovator in Thermal Performance Packaging

Introduction

Zheng Peng Xiong is a notable inventor based in Singapore, recognized for his contributions to the field of thermal performance packaging. He holds a patent that showcases his innovative approach to enhancing the efficiency of circuit dies. With a focus on improving heat dissipation, his work has significant implications for the electronics industry.

Latest Patents

Zheng Peng Xiong has been granted a patent for "High thermal performance packaging for circuit dies." This invention involves a process where a circuit die is placed within a mold, and a molding material is introduced to encapsulate it. Before the molding material fully cures, a portion is removed to create a recessed region. A heat spreader is then positioned within this region, optimizing heat dissipation by reducing the distance between the heat spreader and the spacer.

Career Highlights

Throughout his career, Zheng has worked with prominent companies such as Agere Systems Inc. and Bell Semiconductor, LLC. His experience in these organizations has allowed him to develop and refine his expertise in thermal management solutions for electronic components.

Collaborations

Zheng has collaborated with talented individuals in his field, including Kok Hua Chua and Budi Njoman. These partnerships have contributed to the advancement of his innovative projects and have fostered a collaborative environment for technological development.

Conclusion

Zheng Peng Xiong's work in thermal performance packaging exemplifies the importance of innovation in the electronics sector. His patent reflects a significant advancement in heat management technology, which is crucial for the efficiency and reliability of electronic devices.