Company Filing History:
Years Active: 2021
Title: Zhen Du: Innovator in Semiconductor Packaging
Introduction
Zhen Du is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His innovative work focuses on enhancing the mechanical strength of semiconductor packages.
Latest Patents
Zhen Du holds a patent for a semiconductor package that boasts high mechanical strength. This invention involves singulating a semiconductor wafer to create multiple semiconductor packages. The design includes a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer, and several contact pads. Notably, the rigid supporting layer is thicker than the semiconductor substrate, while the metal layer is thinner. The rigid supporting layer can be made from single crystal silicon or poly-crystal silicon, which may be derived from reclaimed silicon wafers. This approach not only enhances the package's durability but also reduces costs.
Career Highlights
Zhen Du is currently employed at Alpha and Omega Semiconductor (Cayman) Ltd. His work at this company has allowed him to further develop his expertise in semiconductor technologies. His innovative contributions have positioned him as a key figure in the industry.
Collaborations
Zhen Du has collaborated with notable colleagues, including Long-Ching Wang and Kai Chen. These partnerships have facilitated the exchange of ideas and advancements in semiconductor packaging.
Conclusion
Zhen Du's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patent reflects a significant advancement in the field, showcasing his ability to combine functionality with cost-effectiveness.