Yuyu Yan

Title: Yuyu Yan: Innovator in Subframe Bundling Technology

Introduction

Yuyu Yan is a notable inventor based in Beijing, China. He has made significant contributions to the field of communication technology, particularly in the area of subframe bundling. His innovative approach has led to the development of a unique patent that addresses the complexities of communication device operations.

Latest Patents

Yuyu Yan holds a patent for a technology titled "Subframe Bundling." This patent relates to a system where subframe bundling is based on a set of bundling definitions. The invention provides control information for at least one communication device configured to implement subframe bundling. The control information is generated to be at least partially inconsistent with the set of bundling definitions. When the device receives this information, it determines that the received control information is inconsistent with the set of bundling definitions. In response, the device can adjust the state of subframe bundling and/or the size of subframe bundled transmission according to predefined rules.

Career Highlights

Throughout his career, Yuyu Yan has worked with various companies, including HMD Global Oy. His experience in the industry has allowed him to refine his skills and contribute to advancements in communication technologies.

Collaborations

Yuyu Yan has collaborated with notable professionals in the field, including Kari Juhani Hooli and Timo Erkki Lunttila. These collaborations have further enriched his work and expanded the impact of his innovations.

Conclusion

Yuyu Yan's contributions to subframe bundling technology exemplify the importance of innovation in communication systems. His patent reflects a deep understanding of the challenges faced by communication devices and offers a solution that enhances their functionality.