Yung Cheng Lee

Title: Yung Cheng Lee: Innovator in Thermal Management Technologies

Introduction

Yung Cheng Lee is a notable inventor based in Boulder, CO (US). He has made significant contributions to the field of thermal management technologies, holding 2 patents that showcase his innovative approach to engineering solutions.

Latest Patents

One of his latest patents is focused on conformal thermal ground planes. This invention discloses a method of manufacturing a conformal thermal ground plane, which includes forming a first planar containment layer into a first non-planar containment layer with a unique shape. The process also involves creating a second planar containment layer into a second non-planar containment layer, disposing of a liquid cavity and a vapor cavity between these layers, sealing portions of both layers, and charging the liquid cavity with a working fluid. This innovative design aims to enhance thermal management in various applications.

Career Highlights

Yung Cheng Lee has worked with Roccor, LLC and the University of Colorado, where he has applied his expertise in thermal management technologies. His work in these organizations has contributed to advancements in the field and has positioned him as a key figure in thermal engineering.

Collaborations

Throughout his career, Yung Cheng Lee has collaborated with notable professionals, including Michael Hulse and William H. Francis. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Yung Cheng Lee is a distinguished inventor whose work in thermal management technologies has led to innovative solutions and advancements in the field. His contributions continue to influence the industry and inspire future innovations.