Yue Xie

Title: Yue Xie - Innovator in Silicon Wafer Polishing Technology

Introduction

Yue Xie is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor manufacturing, particularly in the polishing of silicon wafers. His innovative approach has led to advancements that enhance the production yield and quality of silicon wafers.

Latest Patents

Yue Xie holds a patent for a "Polishing pad, polishing apparatus and a method for polishing silicon wafer." This invention provides a polishing pad that features a polishing surface in contact with the silicon wafer. The polishing surface is designed with at least one groove, allowing for improved polishing techniques. The method ensures that the edge of the silicon wafer is partially suspended above the groove during polishing. This design reduces the polishing rate at the edge of the silicon wafer while maintaining the overall polishing rate, thereby enhancing the flatness of the edge thickness and improving production yield. He has 1 patent to his name.

Career Highlights

Yue Xie is currently associated with Zing Semiconductor Corporation, where he applies his expertise in semiconductor technology. His work focuses on developing innovative solutions that address challenges in the manufacturing process of silicon wafers.

Collaborations

Yue collaborates with Youhe Sha, who is also a key figure in the field. Their partnership fosters innovation and drives advancements in semiconductor technology.

Conclusion

Yue Xie's contributions to silicon wafer polishing technology exemplify the impact of innovation in the semiconductor industry. His patented methods and collaborative efforts continue to enhance production processes and improve product quality.