Yucheng Ying

Title: Yucheng Ying: Innovator in Electronic Packaging Technology

Introduction

Yucheng Ying is a notable inventor based in San Jose, California, recognized for his contributions to electronic packaging technology. With a total of three patents to his name, Ying has made significant advancements in the field, particularly in the design and functionality of stacked circuit packages.

Latest Patents

Ying's latest patents include a "Stacked Circuit Package with Molded Base Having Laser Drilled Openings for Upper Package." This innovation describes a stacked package configuration that features a bottom package with a substrate and an upper package. The design incorporates a molded layer over the substrate, with laser-drilled holes that align with leads of the upper package, facilitating efficient electrical and thermal connections. Another significant patent is the "Electronic Module for High Power Applications," which outlines an electronic module comprising integrated device packages and vertical interconnects that enhance the performance of high-power electronic systems.

Career Highlights

Throughout his career, Yucheng Ying has worked with prominent companies in the electronics industry, including Analog Devices International Unlimited Company and Linear Technology Holding LLC. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in electronic packaging.

Collaborations

Ying has collaborated with notable professionals in his field, including John David Brazzle and Frederick E. Beville. These collaborations have further enriched his work and expanded the impact of his innovations.

Conclusion

Yucheng Ying's contributions to electronic packaging technology through his patents and collaborations highlight his role as a significant innovator in the industry. His work continues to influence advancements in high-performance electronic systems.